Title:
ELECTROLYTIC COPPER FOIL FOR PRINTED CIRCUIT BOARD AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP3155920
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide electrolytic copper foil adequate for superfine pattern applications having an etching characteristic, high-frequency characteristic and excellent insulation reliability at the time of forming wiring patterns.
SOLUTION: The surface roughness of the rough surface side before a blabbing treatment of this electrolytic copper foil is ≤1.5μm and the surface roughness after the blobbing treatment on the rough surface is 1.5 to 2.0μm. The surface roughness before the blabbing treatment is adjusted to ≤1.5μm by polishing the electrolytic copper foil and the rough surface side of the electrolytic copper foil with buff and the surface roughness is adjusted to 1.5 to 2.0μm by subjecting the rough surface side to the blobbing treatment.
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Inventors:
Tabata Hideyasu
Hiroshi Hirasawa
Kazuhide Ohshima
Hiroshi Hirasawa
Kazuhide Ohshima
Application Number:
JP2161896A
Publication Date:
April 16, 2001
Filing Date:
January 16, 1996
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
H05K1/09; C25D1/04; C25D5/16; C25D5/52; C25F3/16; H05K3/00; H05K3/06; H05K3/38; (IPC1-7): C25F3/16; H05K1/09; H05K3/00
Domestic Patent References:
| JP2108532A |
Attorney, Agent or Firm:
Tetsuya Ito