PURPOSE: To improve a shield effect in a structure of a complicated shape, by disposing a metallic thin film on a dry formation type conductive film and performing molding unified formation and next peeling a conductive base film.

CONSTITUTION: A metallic thin film 2 is disposed on a conductive layer 5 formed on a base film 4 by a dry film formation method, and next an adhesive layer 3 is formed on the film 2. Their films are put into a metallic mold 6, and fused plastics supplied from a supply channel 7 are used to provide them with molding formation. The metallic thin film 2 is closely stuck on a formed plastic mold 1. The base film 4 is peeled after the molding is finished. A mold excellent in its shield effect can be thus obtained.