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Title:
ELECTROMAGNETIC WAVE ATTENUATION BODY AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2023070230
Kind Code:
A
Abstract:
To provide an electromagnetic wave attenuation body that can increase the attenuation characteristics of an electromagnetic wave and an electronic device.SOLUTION: The electromagnetic wave attenuation body according to an embodiment includes a laminate member including a first sheet part. The first planer part includes a first laminate body. The first laminate body includes a plurality of first magnetic layers and a plurality of first non-magnetic layers containing Cr and Ti. The direction from first one of the first magnetic layers to second one of the first magnetic layers extend along a first direction. One of the first non-magnetic layers is located between the first one of the magnetic layers and the second one of the first magnetic layers. The first one of the first non-magnetic layers includes an amorphous region. The first one of the first magnetic layers and the second one of the first magnetic layers include a crystal region.SELECTED DRAWING: Figure 1

Inventors:
KIKITSU SATORU
KUROSAKI YOSHINARI
SHIRATORI SATOSHI
Application Number:
JP2021182265A
Publication Date:
May 19, 2023
Filing Date:
November 09, 2021
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H05K9/00; B32B7/025; H01F10/30; H01L23/00; H01L23/28
Attorney, Agent or Firm:
Masahiko Hyugaji
Junichi Kozaki
Hiroshi Ichikawa
Tatsuaki Shirai
Takato Uchida
Isao Takeuchi