Title:
ELECTRONIC CIRCUIT AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2022147904
Kind Code:
A
Abstract:
To provide an electronic circuit that is reduced in size by making good use of interaction between adjacently arrayed structures, and a circuit board.SOLUTION: An EBG (Electromagnetic Band Gap) structure comprises a ground 11, a stub 13 formed in a different conductor layer from the ground 11, and a via 12 connecting the ground 11 and the stub 13. Further, the unit circuits constituting the EBG structure are each provided with a via 14 connecting with the stub 13 at a plurality of places where the stub 13 extends halfway. Unlike the via 12, the vias 14 are not connected to the ground 11. The vias 14 which are not connected to the ground 11 are arranged at adjacent positions not across a conductor line of the stub 13 when the plurality of unit circuits are arrayed.SELECTED DRAWING: Figure 7
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Inventors:
HORIKAWA DAISUKE
Application Number:
JP2021049368A
Publication Date:
October 06, 2022
Filing Date:
March 24, 2021
Export Citation:
Assignee:
FUJIFILM BUSINESS INNOVATION CORP
International Classes:
H01P1/00; H01Q15/14; H05K1/02; H05K3/46; H05K9/00
Attorney, Agent or Firm:
Masaki Yamada
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