PURPOSE: To enable a package provided with a terminal resistor whose both ends are connected to the end of a signal line and a ground circuit respectively to be easily formed by a method wherein a base plate is made to adhere to the back of a package main body, and the bottom of a cavity is sealed up with the base plate concerned.

CONSTITUTION: A high frequency element housing package 10 is provided, where a terminal resistor 60 whose one end is connected to the end of an electrode connecting signal line 20 of a high frequency element around a cavity and other end is connected to a ground circuit 40 of the package 10 is provided to the inner side face of the cavity 30 or the front end face of a step provided to the side face of a recess 12. A viahole filled with metallized conductor or provided with metallized conductor on its inner circumferential surface is provided to the package 10 of ceramic. By this setup, a required package can easily be obtained without costing much labor.