To provide an electronic circuit component loading apparatus and a method for covering displacement between the attracting end surface of attracting nozzle and electronic circuit component while eliminating deterioration of attracting efficiency.

Components are unloaded from a component supplying portion of a feeder and these components are loaded on a printed wiring board. The amount of displacement from the center of a component 20 placed at the center of the attracting end surface is obtained on the basis of the imaging of the component after it has been unloaded. When the component is small in size and has the square plan view, the displacement is compared with the preset value. If the displacement is larger than the present value, the loading is inhibited and the interference between the attracting end surface and loaded component is eliminated. In the first unloading, unloading position from the feeder is compensated for cancelling the displacement for nozzle rotating axis of the attracting end surface and the displacement for regular position of the nozzle rotating axis. In the second and subsequent unloading, unloading position is compensated to cancel the displacement from the center of the component at the center of the attracting end surface for reduction of inhibited loading. It is also possible to inhibit the loading when the amount of projection from the external line of the component at the attracting end surface is larger than the preset value.