Title:
ELECTRONIC CIRCUIT MODULE
Document Type and Number:
Japanese Patent JP2016219661
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic circuit module in which a desired area, on which electronic components are mounted, is securely covered with an insulating coat layer.SOLUTION: An electronic circuit module comprises: a circuit board 20 in which electronic components EP are mounted on one surface; and a frame 10 enclosing one surface side of the circuit board 20. The circuit board 20 has a coat area CA1 to which an insulating coating material for covering the electronic components EP is applied. The frame 10 has: first wall parts 11 surrounding at least parts of an outer periphery of the circuit board 20; and second wall parts 12, each of which contacts with or is located close to the one surface of the circuit board 20 and is provided between the first wall part 11 and the coat area CA1.SELECTED DRAWING: Figure 5
Inventors:
SAITO TATSUO
Application Number:
JP2015104716A
Publication Date:
December 22, 2016
Filing Date:
May 22, 2015
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD
International Classes:
H05K9/00