Title:
ELECTRONIC COMPONENT MOUNTING METHOD AND MANUFACTURING METHOD FOR MICRO-LED DISPLAY
Document Type and Number:
Japanese Patent JP2022054148
Kind Code:
A
Abstract:
To improve the yield when mounting an electronic component.SOLUTION: An electronic component mounting method for mounting an electronic component on a substrate having a circuit mounted thereon includes the steps of: attaching a first transfer member 3 whose adhesion force decreases by irradiation with UV ray to a light-transmitting substrate 2 where a plurality of electronic components 1 are formed in accordance with a predetermined arrangement on one surface; transferring the electronic components 1 to one surface of the first transfer member 3 by laser lift-off for separating the electronic components 1 from the light-transmitting substrate 2; after performing processing for preventing exposure to oxygen on the first transfer member 3, to which the electronic components 1 have been transferred, irradiating the first transfer member 3 with UV rays so as to decrease the adhesive force of the first transfer member 3; by the use of a second transfer member 5 whose adhesive force is higher than that of the first transfer member 3 with the decreased adhesive force, transferring the electronic components 1 from the first transfer member 3 to the second transfer member 5 by using a difference in adhesive force; and mounting the electronic components 1 from the second transfer member 5 to a substrate 6.SELECTED DRAWING: Figure 1
Inventors:
NISHIDA KOJI
Application Number:
JP2020161183A
Publication Date:
April 06, 2022
Filing Date:
September 25, 2020
Export Citation:
Assignee:
V TECH CO LTD
International Classes:
H01L21/60; G09F9/00; G09F9/33; H01L33/48; H05K13/04
Attorney, Agent or Firm:
Ogawa Mitsuaki
Nishiyama Haruyuki
Okuyama Shoichi
Nishiyama Haruyuki
Okuyama Shoichi