Title:
電子部品搭載基板およびその製造方法
Document Type and Number:
Japanese Patent JP7141864
Kind Code:
B2
Abstract:
To provide: an electronic component mounting board including a metal plate which is made of aluminum or an aluminum alloy and on which an electronic component is mounted, the electronic component mounting board being capable of preventing the electronic component from being peeled off from the metal plate even when a power cycle test is performed; and a manufacturing method thereof.SOLUTION: An electronic component mounting board includes a metal plate 10 which is made of aluminum or an aluminum alloy and on one main face of which an electronic component 20 is mounted. In a manufacturing method of the electronic component mounting board, a nickel coating 12, a palladium coating 14 and a silver coating 16 are formed in this order on the main face of the metal plate 10; a silver paste is applied on the silver coating 16 and the electronic component 20 is disposed on the silver paste; then, silver in the silver paste is sintered to form a silver joining layer 18; and the electronic component 20 is joined to the one face of the metal plate 10 by the silver joining layer 18.SELECTED DRAWING: Figure 1
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Inventors:
Seiya Yuki
Application Number:
JP2018118419A
Publication Date:
September 26, 2022
Filing Date:
June 22, 2018
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
H01L21/52; H01L23/13; H01L23/14; H01L23/15
Domestic Patent References:
| JP2014130989A | ||||
| JP6252182A |
Attorney, Agent or Firm:
Koichi Okawa
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