INSULATING BOARD FOR SEMICONDUCTOR ELEMENT

Title:

INSULATING BOARD FOR SEMICONDUCTOR ELEMENT

Document Type and Number:

Japanese Patent JPH0472638

Kind Code:

A

Abstract:

PURPOSE: To reduce a warp which is caused by a method wherein a metallized face for warp-prevention use is formed in such a way that a metallized pattern on the side of a semiconductor element and a metallized pattern on the side of a heat sink are nearly the same.

CONSTITUTION: Metallized faces 2 for warp-prevention use are formed on the side of a semiconductor element on an insulating board 1 in addition to a metallized face 3 for a power-transistor chip mounting part, an aluminum-pad mounting part and a part in which a power-transistor chip and an aluminum pad are made conductive. The metallized faces 2 for warp-prevention use are formed on the side of the semiconductor element on the insulating board 1 in such a way that a metallized pattern on the side of the semiconductor element for semiconductor element use and a metallized pattern on the side of a heat sink on the insulating board 1 are nearly the same. As a result, it is possible to reduce a warp, of the insulating board 1, caused at a sintering process of the insulating board..

Inventors:

HASEGAWA TAKASHI
KATAGISHI KENICHI
KOIKE HIROSHI

Application Number:

JP18396290A

Publication Date:

March 06, 1992

Filing Date:

July 13, 1990

Export Citation:

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Assignee:

HITACHI LTD
HITACHI AUTOMOTIVE ENG

International Classes:

H05K1/02; H01L21/52; (IPC1-7): H01L21/52; H05K1/02

Attorney, Agent or Firm:

Katsuo Ogawa (2 outside)

Next Patent: DIE BONDING APPARATUS