To provide an electronic component having a high Q value, excellent in reliability and reduced in cost, to provide a screen printing plate, and to provide a manufacturing method of an electronic component using the same.
A via hole 20 extends in a thickness direction d inside a base body part 10, with a hole opening 21 provided on one surface 101. A vertical conductor 30 includes first and second conductor parts 31 and 32. The first conductor part 31 is packed in the via hole 20. The second conductor part 32 strides the periphery of the hole opening 21 and is partially extended to one surface 101, being continuous to the first conductor part 31. A screen printing plate 4 includes main and sub plate openings 41 and 42. The main plate opening 41 is provided to fill the via hole 20 with a conductive paste. The sub plate opening 42 is opened, in protruding shape, at a part of the periphery of the main plate opening 41. A manufacturing method of the electronic component related to this invention uses the screen printing plate 4.
TOMAKI SHIGEMITSU
TSUYA YOSHIKAZU
SATO MINORU
MASUDA HIDEKI
| JPH04242995A | 1992-08-31 | |||
| JP2002118347A | 2002-04-19 | |||
| JP2003198085A | 2003-07-11 | |||
| JPH05235553A | 1993-09-10 | |||
| JP2003204168A | 2003-07-18 | |||
| JP2002353606A | 2002-12-06 |
Yoshikazu Takei
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