Title:
ELECTRONIC COMPONENT WITH SHIELD CAP
Document Type and Number:
Japanese Patent JP3921396
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component having a shield cap, which is capable of preventing the occurrence of short-circuiting defects even if an external stress is applied to it or there is positional deviation.
SOLUTION: The electronic component with a shield cap comprises a circuit board which is mounted with electronic component elements on the top face, the body of the shield cap which is adhered or fastened to the top face or side faces of the circuit board so as to cover the electronic component elements on the circuit board. An insulation resin material is applied between at least some of the electronic component elements at least on the circuit board which have exposed conductive parts and the body of the shield cap in close vicinity to those electronic component elements.
Inventors:
Hayakawa Toshitaka
Application Number:
JP2002045824A
Publication Date:
May 30, 2007
Filing Date:
February 22, 2002
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01L23/00; H05K9/00; (IPC1-7): H01L23/00; H05K9/00
Domestic Patent References:
| JP6125191A | ||||
| JP7142848A | ||||
| JP2000323596A |
Attorney, Agent or Firm:
Takao Hamano
Morita Tetsuji
Teruichi Hirai
Morita Tetsuji
Teruichi Hirai
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