To provide an electronic device which can reduce the mounting area.
The electronic device is provided with a basic material 1 to be mounted on the surface of a circuit board. On the surface of the basic material 1 and within the same basic material 1, one or a plurality of electronic component elements are mounted. Simultaneously, at the end of the basic material 1, external electrodes 2 for connecting one or a plurality of electronic component elements to the circuit board are formed like vertical poles to the rear surface 19 of the basic material and are exposed to the rear surface 19 of the basic material. Moreover, at the end of the basic material 1, an inclining surface 11 is formed crossing the side surface 10 and the rear surface 19 of the basic material, and the surface of the external electrodes 2 is exposed to the inclining surface 11.
HONGO MASAKI
FUKUYAMA MASAMI
OGURA TAKASHI
Next Patent: EXPOSURE METHOD, ALIGNER AND DEVICE MANUFACTURING METHOD