Title:
ELECTRONIC EQUIPMENT CASE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3644143
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce the manufacturing manhours by making the handling of a conductive body easy and simultaneously molding integrally the conductive body with a plurality of tongues and a frame.
SOLUTION: In the constitution of a case in which an upper frame and a lower frame 5 are fitted splittably through a conductive plate 71 for connecting electrically the frames, one frame is constituted of an integrally molded composite body composed of the conductive plate 71 with a plurality of tongues 711 formed on a U-shaped notched channel on its fitting face, an auxiliary plate with small holes corresponding to the tongues 711 and resin coating the plates, and the tongues 711 are folded and protruded on the fitting face side by the resin injecting force at the molding time.
Inventors:
Kenshin Ishizuka
Kota Nishii
Koichi Kimura
Kota Nishii
Koichi Kimura
Application Number:
JP20826696A
Publication Date:
April 27, 2005
Filing Date:
August 07, 1996
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K5/00; B29C33/12; B29C45/14; G06F1/16; H05K9/00; B29K101/12; B29K705/00; B29L22/00; B29L31/34; (IPC1-7): B29C45/14; B29C33/12; G06F1/16; H05K9/00
Domestic Patent References:
| JP4135816A | ||||
| JP58094619A | ||||
| JP8047986A | ||||
| JP64061097A |
Attorney, Agent or Firm:
Shigeru Iwata