PURPOSE: To make an electronic equipment-light weight and miniature by a method wherein a circuit pattern of a wiring board is overcoated with an electric wave noise shielding conductive layer through the intermediary of an electric insulating layer, and electric wave noises are grounded through the conductive layer.

CONSTITUTION: A circuit substrate 20a, which is provided to a central part and an electronic component 3 is fixed to, is covered with an outermost conductive layer 20c of a coating formed of a conductive powder material such as aluminum, carbon, or the like through the intermediary of an electric insulating layer 20a of resin or the like which covers the surface circuit pattern. The conductive layer 20c is grounded to, for instance, a lower case 2 through a high frequency impedance Z. Consequently, electric wave noises are grounded through the conductive layer 20c, so that an equipment can be made light-weight and miniature.