Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MANUFACTURE OF CERAMIC MULTILAYER SUBSTRATE
Document Type and Number:
Japanese Patent JPH01258495
Kind Code:
A
Abstract:

PURPOSE: To obtain a ceramic multilayer substrate excellent in a dimensional accuracy by a method wherein a material, which is hard to be fluidized and move when heat and pressure are applied at a laminating process, is filled into two or more holes provided around a circuit forming part of a green sheet so as to decrease the ununiformity of a laminated piece of green sheets in density.

CONSTITUTION: A green sheet 1 is punched out to provide through-holes 2 at the central part of the sheet 1. Two or more through-holes 4 are provided around a circuit forming part to built a green sheet fluidization preventing section. A paste-like material composed of a tunstem powder to which ethyl cellulose is added is filled into the through-holes 2 and 4. Four green sheets 1 are laminated and bonded by pressure. A circuit forming part of the central part of the sheet 1 is punched out, which is sintered. As the paste-like material is not softened at a laminating temperature, ceramic powder and binder resin of the circuit forming part are prevented from flowing to a peripheral part by the through-holes 4. By these processes, the laminated piece of the sheets 1 is decreased in ununiformity of density, so that a ceramic multilayer substrate excellent in dimensional accuracy can be obtained.


Inventors:
FUJITA TAKESHI
ISHIHARA SHOSAKU
KUROKI TAKASHI
TSUCHIDA SEIICHI
NOMA TATSUJI
Application Number:
JP8504388A
Publication Date:
October 16, 1989
Filing Date:
April 08, 1988
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)



 
Previous Patent: FORMATION OF CONDUCTIVE FILM

Next Patent: ELECTRONIC EQUIPMENT