PURPOSE: To obtain a small-sized electronic part, which has large heat- dissipating properties and a semiconductor chip.

CONSTITUTION: The area of the greater part of one surface of an insulating substrate 2 is covered with a metallic conductive layer 3, and used as a pad 5 for loading an IC chip while pads 6 for electrodes insulated from the pad 5, pads 7 for chip parts, etc., are formed to the partial fine section of the pad 5, a plurality of pads for external connection are formed along one side edge section of an electrical wiring board 1, and the IC chip 20 is mounted to the pad 5 for loading the IC chip. The chip parts 22 are mounted to the pads 7 for the chip parts, and these electronic-circuit components are connected by wiring patterns on the other surface of the substrate 1 and bonded with the pads for external connection. Accordingly, the pad 5 for loading the IC chip having a large area is employed as a heat sink, thus improving heat-dissipating properties. The pad 5 is grounded, thus also providing a shielding effect.