Title:
ELECTRONIC PARTS AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP3303791
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a small sealing type electronic parts of a simple structure with its high production yield and with no occurrence of the faulty parts and also to improve the electrical characteristic of the electronic parts.
SOLUTION: The input/output electrodes 56 and element seal rings 57 of an interdigital electrode 55 are placed on the surface of a surface acoustic wave element 52. The inside draw-out electrodes 58 and substrate seal rings 61 are placed on the top surface of a mount substrate 53. Then a projecting electrode 62 is placed on each electrode 58, and a sealing material 63 such as solder is placed on each ring 61. The electrode 62 is set higher than the material 63 before the electrode 62 is bonded to the material 63. Thereby, the element 52 is put upside down on the substrate 53 to secure contact of the electrode 62 to the electrode 56. Then the electrode 62 is heated and pressed to be bonded to each electrode 56 and also the material 63 is bonded to each ring 57.
Inventors:
Yoshitsugu Hori
Application Number:
JP24825898A
Publication Date:
July 22, 2002
Filing Date:
September 02, 1998
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L41/09; H03H3/08; H03H9/02; H03H9/10; H03H9/145; H03H9/25; (IPC1-7): H03H3/08; H03H9/02; H03H9/10; H03H9/25
Domestic Patent References:
| JP11150441A | ||||
| JP9162690A |
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