To provide an electroplating method which is capable of stably maintaining an electroplating bath by using a tin-base alloy not containing lead when the surface treatment of members to be plated, such as parts of electronic apparatus, etc., and junctures of wiring boards is performed by the electroplating method and a method of managing this electroplating bath.
This electroplating method comprises, as an electroplating of the tin-base alloy, simultaneously immersing an anode consisting of tin and a cathode consisting of the member to be plated into an acidic electrolytic plating bath containing tin and at least one copper, silver and bismuth and simultaneously pulling up the same. The management of the electroplating bath when the electroplating is not performed is performed by using the cathode consisting of the above tin anode and the cathode consisting of a material insoluble in an acid and keeping passing slight current to the anode.
KAMATA HIROYUKI
MIMURA SHOJI
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