PURPOSE: To provide an electroplating method capable of forming metallic films in a part of parts to be plated with a simple device without causing a shape deformation, damage, etc., in an object to be plated.

CONSTITUTION: An anode 9 and a cathode 10 are disposed to face each other in a plating liquid 7 and the object 11 to be plated consisting of a conductive metal is immersed and arranged in the plating liquid 7 between these two electrodes. A DC is passed by an external DC power source 8 and the metallic plating film 15 is formed on the surface of the object 11 to be plated facing the anode 9. A cation exchange membrane or anion exchange membrane is disposed to enclose the cathode 10 in such method, by which the permeation of metal ions or metal complex ions of the code different from the code of these exchange membranes is prohibited and the plating on the cathode 10 is averted.