Title:
SN PLATED WIRE FOR ELECTRICAL CONTACT POINT AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JPH07157893
Kind Code:
A
Abstract:
PURPOSE: To provide a Sn plated wire and its producing method small in the deterioration of contact resistance with the lapse of time and capable of using as an electric contact material.
CONSTITUTION: The Sn plated wire is constituted so as to cover the surface of a Cu or Cu alloy wire with a layer of Sn or Sn alloy having ≥2μm crystal particle diameter. The Sn plated wire is produced by forming the Sn or Sn alloy plated layer on the surface of the Cu or Cu alloy wire by electroplating method and cooling after keeping at Tm to Tm minus 50°C for ≥2 seconds where the m.p. of the plated layer is Tm (°C).
Inventors:
SUZUKI SATOSHI
MATSUDA AKIRA
SUZUKI YUJI
KAWADA KENJI
MIIKE TERUHISA
MATSUDA AKIRA
SUZUKI YUJI
KAWADA KENJI
MIIKE TERUHISA
Application Number:
JP30815293A
Publication Date:
June 20, 1995
Filing Date:
December 08, 1993
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
ALPS ELECTRIC CO LTD
ALPS ELECTRIC CO LTD
International Classes:
C25D3/30; C25D5/50; C25D7/00; C25D7/06; (IPC1-7): C25D7/00; C25D3/30; C25D5/50; C25D7/06
Attorney, Agent or Firm:
Koji Nagato