PURPOSE: To easily, efficiently and selectively deposit and form a required plating layer with a high accuracy by liquid-tightly bringing a shell cup having apertures corresponding to IC land pad group regions to be plated into pressu rized contact with the surface of a wiring board.

CONSTITUTION: The plating shell cup 4 having the apertures corresponding to the IC land pad group regions to be plated is liquid-tightly brought into pressurized contact with the surface of the wiring board by the pressurizing contact means 6. The plating liquid is then circulated via supply and discharge ports 4b, 4c to the plating shell cup 4. The plating liquid is supplied by a plating liquid circulating means (not shown in Fig.) having a plating liquid storage tank, filter, anode shell and circulating pump, etc. Further, the wiring board 1 is connected to a cathode lead 4e and is energized together with the anode in the anode shell.