PURPOSE: To uniformly deposit a plating film over the whole substrate at the time of wet-plating the substrate having a through-hole by allowing a plating soln. to flow vertically to the through-hole and making the flow velocity of the soln. flowing on one side of the substrate differ from that of the soln. flowing on the other side.
CONSTITUTION: A substrate 1 having a through-hole 2 is wet-plated. In this case, a plating soln. is allowed to flow vertically to the through-hole 2, the flow velocity of the soln. flowing on one side of the substrate 1 is made to differ from that of the soln. flowing on the other side, and a discharge pipe 3 is set below the substrate 1 to facilitate the flow of the soln. Consequently, a pressure difference is developed between both sides of the substrate 2 through the through-hole 2, the soln. is allowed to flow from the high-pressure side to the low-pressure side in the through-hole 2, and a plating film is uniformly deposited on the whole substrate 1.
TONE KAORU
YOSHIZAWA IZURU
