Title:
METHOD FOR CLEANING ELECTROPLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/109465
Kind Code:
A1
Abstract:
Disclosed in the present invention is a method for cleaning an electroplating device. When the electroplating device is cleaned, a partition plate is used for replacing an ionic membrane framework to isolate a cathode cavity from an anode cavity, such that the cathode cavity and the anode cavity are independently cleaned. After an electroplating cavity is cleaned, a pumping and draining pipe is used for emptying a cleaning solution remaining in the anode cavity and in a liquid input channel arranged in a side wall of the anode cavity, such that no cleaning solution remains after the electroplating cavity is cleaned, thereby eliminating the effect of the residual cleaning solution on the ionic concentration ratio of an electroplating solution in electroplating solution preparation procedures.
Inventors:
LI JIAQI (CN)
WANG JIAN (CN)
JIA ZHAOWEI (CN)
DIAO JIANHUA (CN)
YANG HONGCHAO (CN)
WANG HUI (CN)
WANG JIAN (CN)
JIA ZHAOWEI (CN)
DIAO JIANHUA (CN)
YANG HONGCHAO (CN)
WANG HUI (CN)
Application Number:
PCT/CN2022/134114
Publication Date:
June 22, 2023
Filing Date:
November 24, 2022
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
C25D21/00; C25D5/08; C25D17/02; C25D21/08
Foreign References:
| CN111032923A | 2020-04-17 | |||
| CN207243447U | 2018-04-17 | |||
| US20040016647A1 | 2004-01-29 | |||
| CN212669846U | 2021-03-09 | |||
| US20050092601A1 | 2005-05-05 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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