Title:
チャック力制御を有する静電チャック基板支持体
Document Type and Number:
Japanese Patent JP7107972
Kind Code:
B2
Abstract:
Embodiments described herein provide methods and apparatus used to reduce or substantially eliminate undesirable scratches to the non-active surface of a substrate by monitoring and controlling the deflection of a substrate, and thus the contact force between the substrate and a substrate support, during substrate processing. In one embodiment a method for processing a substrate includes positioning the substrate on a patterned surface of a substrate support, where the substrate support is disposed in a processing volume of a processing chamber, applying a chucking voltage to a chucking electrode disposed in the substrate support; flowing a gas into a backside volume disposed between the substrate and the substrate support, monitoring a deflection of the substrate, and changing a chucking parameter based on the deflection of the substrate.
Inventors:
Boyd Jr. Wendell Glen
He Jim Jung Gi
Din Jen Wen
He Jim Jung Gi
Din Jen Wen
Application Number:
JP2019563804A
Publication Date:
July 27, 2022
Filing Date:
August 22, 2018
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/683; H01L21/3065; H02N13/00
Domestic Patent References:
| JP2010147502A | ||||
| JP4111339A | ||||
| JP2000031252A | ||||
| JP4345050A | ||||
| JP2015111074A | ||||
| JP11251420A |
Foreign References:
| US20170076915 |
Attorney, Agent or Firm:
Yoshiaki Anzai
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