EPOXY RESIN COMPOSITION

Title:

EPOXY RESIN COMPOSITION

Document Type and Number:

Japanese Patent JPH0258530

Kind Code:

A

Abstract:

PURPOSE:To provide the title composition causing no foaming, discoloration and cure strain in the cured products therefrom when used for sealing photosemiconductor elements, comprising an epoxy resin, acid anhydride curing agent, curing promotor such as diazabicycloalkene salt and water in specified proportion. CONSTITUTION:The objective composition comprising (A) 100 pts.wt. of an epoxy resin (e.g., bisphenol type epoxy resin), (B) 70-150 pts.wt. of an acid anhydride curing agent (e.g., hexahydrophthalic anhydride), (C) 0.1-5 pts.wt. of a curing promotor consisting of a diazabicycloalkene salt [e.g., hexanoic acid salt of 1,8-diazabicyclo(5,4,0)undecene-7] and/or an onium salt (e.g., benzyltrimethylammonium iodide), and (D) 0.05-2 pts.wt. of water.

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Inventors:

WADA HIROSUKE
AZUMA MICHIYA
MIYAMURA MASATAKA

Application Number:

JP20860788A

Publication Date:

February 27, 1990

Filing Date:

August 23, 1988

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

C09K3/10; C08G59/68; H01L23/29; H01L23/31; (IPC1-7): C08G59/68; C09K3/10; H01L23/29; H01L23/31

Attorney, Agent or Firm:

Takehiko Suzue (2 outside)

Next Patent: PRODUCTION OF WHOLLY AROMATIC POLYESTER