Title:
ガス状副生成物軽減およびフォアライン洗浄のための装置
Document Type and Number:
Japanese Patent JP7083424
Kind Code:
B2
Abstract:
Embodiments disclosed herein include an abatement system and method for abating compounds produced in semiconductor processes. The abatement system includes a remote plasma source for generating an oxidizing plasma for treating exhaust gases from a deposition process performed in the processing chamber, the treatment assisting with the trapping particles in an exhaust cooling apparatus. The remote plasma source then generates a cleaning plasma for treating exhaust gases from a cleaning process performed in the processing chamber, the cleaning plasma reacting with the trapped particles in the exhaust cooling apparatus and cleaning the exhaust cooling apparatus.
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Inventors:
Leroux James
Application Number:
JP2021512360A
Publication Date:
June 10, 2022
Filing Date:
April 16, 2019
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/205; C23C14/00; C23C16/44; H01L21/3065
Domestic Patent References:
| JP2017526179A | ||||
| JP2017510453A | ||||
| JP2013235925A |
Attorney, Agent or Firm:
Shinichiro Tanaka
Yoshi Kazuhiko Ta
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Yoshiaki Kudo
Yoshi Kazuhiko Ta
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Yoshiaki Kudo
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