EQUIPMENT AND METHOD FOR SUBSTRATE TREATMENT

Title:

EQUIPMENT AND METHOD FOR SUBSTRATE TREATMENT

Document Type and Number:

Japanese Patent JP2004273714

Kind Code:

A

Abstract:

To provide substrate treatment equipment which improves an operating ratio with reduced working manday, and to provide a method for substrate treatment using this.

Long arms 91a and 91b are provided with suction pads 95a to 95j, which are connected with pipings 138a to 138j respectively through connection pipes 139a to 139j. The pipings 138a to 138j are connected with vacuum pumps 136a to 136j. The connection pipes 139a to 139j are provided with pressure sensors 131a to 131j for individually measuring the suction pressure of the suction pads 95a to 95j. Furthermore, the connection pipes 139a to 139j are provided with pressure control valves 135a to 135j for individually adjusting the suction pressure of the suction pads 95a to 95j. Thus, the substrate G can be sucked with vacuum independently by each suction pad.

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Inventors:

SARAI YASUO

Application Number:

JP2003061650A

Publication Date:

September 30, 2004

Filing Date:

March 07, 2003

Export Citation:

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Assignee:

TOKYO ELECTRON LTD

International Classes:

B65G49/06; H01L21/027; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; B65G49/06; H01L21/027

Attorney, Agent or Firm:

Junichi Omori

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