Title:
エッチング剤及びこれを用いた電子機器用基板の製造方法と電子機器
Document Type and Number:
Japanese Patent JP3974305
Kind Code:
B2
Abstract:
The present invention provides an etching agent that is able to etch a Cu film by a simple chemical etching method such as an immersion method when the low resistance Cu film is used for a wiring material, while allowing time-dependent changes of the etching rate to be small and preventing a pattern narrowing phenomenon ascribed to irregular amount of side etching of the Cu film from occurring, by providing an etching agent comprising an aqueous solution containing potassium hydrogen peroxosulfate and hydrofluoric acid, wherein masks of a give pattern is formed on the surface of a laminated film prepared by sequentially depositing a Ti or Ti alloy film and a Cu film on a substrate, and wherein a gate electrode (a laminated wiring) and a lower pad layer (a laminated wiring) with give patterns are formed by etching the laminated film using the etching agent having the foregoing construction.
Inventors:
Jo Kei Tetsu
Sekisai
Sekisai
Application Number:
JP2000001127A
Publication Date:
September 12, 2007
Filing Date:
January 06, 2000
Export Citation:
Assignee:
LJ Phillips LCD Company Limited
International Classes:
C23F1/18; H01L21/3205; C09K13/00; C09K13/06; C23F1/26; H01L21/302; H01L21/308; H01L21/336; H01L23/52; H01L29/786; H01L21/77; H01L29/45; H01L29/49
Domestic Patent References:
| JP11140669A | ||||
| JP8253400A | ||||
| JP3053084A | ||||
| JP11172467A | ||||
| JP8046331A | ||||
| JP6260762A |
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Kobayashi Yoshinori