To obtain a molding material excellent in transparency, heat sealability and mechanical strength and capable of exhibiting antistatic properties even at a low humidity and sustaining the antistatic properties over a long period.

This ethylenic resin composition is obtained by compounding (A) an ethylene-α-olefin copolymer produced in the presence of a single-site catalyst and having 880-945 kg/m3 density, 0.05-100 g/10 min melt flow rate at 190°C under 2,160 g load and ≤2.5 weight-average molecular weight/number- average molecular weight, (B) an ionomer of an ethylene-unsaturated carboxylic acid copolymer and (C) a polyhydroxy compound. The amounts of the compounded components are 60-95 pts.wt. of the component A and 5-40 pts.wt. of the component B. The amount of the compounded component C is 0.1-30 wt.% based on the component B.