Title:
FABRICATION OF TRANSFER METAL FILM SUPPLY AND MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH0745471
Kind Code:
A
Abstract:
PURPOSE: To provide a method for fabricating a transfer metal film supply in which the delamination from a supporting film can be controlled highly accurately.
CONSTITUTION: The method for fabricating a transfer metal film supply comprises a step of forming a first film of such metal as can be etched relatively easily on a supporting film 1, a step of forming a second film 3 of such metal as can not be etched easily on the first metal film 2 by a thin film forming method, and a step patterning a laminated metal film 4 by etching to obtain a transfer metal film 4A.
Inventors:
KAWABATA KAZUAKI
WADA NOBUYUKI
WADA NOBUYUKI
Application Number:
JP18521093A
Publication Date:
February 14, 1995
Filing Date:
July 27, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/12; H01G4/30; (IPC1-7): H01G4/12; H01G4/30
Attorney, Agent or Firm:
Contents Makoto (1 person outside)
Next Patent: MULTILAYER CERAMIC ELEMENT