To provide a film deposition apparatus and a film deposition method for uniformly forming a film on the entire surface of a grainy substrate.
The film deposition apparatus includes: a plate having a main surface on which a grainy substrate for film deposition processing is mounted, and including a plurality of grooves which extends parallel to the main surface with the width smaller than the grain size of the grainy substrate and which are formed in the main surface; an oscillating mechanism for oscillating the plate in the direction parallel to the main surface so that the grainy substrate starts rolling on the main surface when a part of the grainy substrate is fitted in the grooves; and a thin film forming mechanism which forms a thin film on an exposed surface of the grainy substrate on the main surface.
MORIMOTO YOSUKE
| JP2010111920A | 2010-05-20 |
Masakazu Ito
Suzuki Isobe
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