Title:
FLAT POWER SUPPLY
Document Type and Number:
Japanese Patent JP3032379
Kind Code:
B2
Abstract:
PURPOSE: To make the thickness of the whole power supply smaller than the conventional thickness by connecting the circuit pattern of a printed board with the circuit pattern of a metal chassis so that parts mounted on the printed board are contained in the opening of a metal plate.
CONSTITUTION: A metal chassis 10 is composed of a metal plate 11 provided with an opening 11a, insulating film 12 provided in the metal plate 11 and circuit patterns(CPs) 13 provided on the insulating film 12. Bare chips 22a are mounted in a part of the CPs 13. The bare chips 22a are connected with desired CPs23 of a printed board 20. Connecting means 30 connect the CPs 23 with the CPs 13 so that the parts 21 mounted on the printed board 20 are contained in the opening 11a. That is, the parts are arranged so as to be buried in the metal plate 11 when the height of the parts 21 is smaller than the thickness of the metal plate 11 and so as to protrude by larger part from the metal plate 11 when the height of the parts 21 is larger than the thickness of the metal plate 11. Therefore, it is possible to make the thickness of a power supply thinner.
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Inventors:
Tadao Kikuchi
Toshihiko Masuyama
Toshihiko Masuyama
Application Number:
JP14810292A
Publication Date:
April 17, 2000
Filing Date:
May 14, 1992
Export Citation:
Assignee:
Origin Electric Co., Ltd.
International Classes:
H01R12/71; H02M3/155; H05K1/14; H05K1/05; (IPC1-7): H02M3/28; H05K1/14
Domestic Patent References:
| JP3145967A | ||||
| JP1259755A | ||||
| JP5304764A | ||||
| JP51130449U | ||||
| JP189793U | ||||
| JP488383U |
Attorney, Agent or Firm:
Shinichi Kawakubo