Title:
FLAT SHIELDING CIRCUIT BODY AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH08190812
Kind Code:
A
Abstract:
PURPOSE: To provide a manufacture of a flat shielding circuit body and by which the flat shielding circuit body is easily manufactured.
CONSTITUTION: In one half portion of the conductive layer of a base film 1 plural circuits 14 to 16 are formed by etching, while in the other half a circuit plate 21 is formed leaving a shielding conductive layer 17. A conductive adhesive 19 is applied to an outside earth circuit 15, while an insulating adhesive 20 is applied to the other circuits, and the circuit plate 21 is folded back in the center. The shielding conductive layer 17 is connected to the earth circuit 15, and is bonded with the other circuits via the insulating adhesive.
Inventors:
TAKIGUCHI SHUJI
Application Number:
JP264395A
Publication Date:
July 23, 1996
Filing Date:
January 11, 1995
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H05K9/00; H01B7/08; H01B7/17; H01B13/00; H05K1/02; H05K1/00; (IPC1-7): H01B7/08; H01B7/18; H01B13/00; H05K1/02; H05K9/00
Attorney, Agent or Firm:
Hideo Takino (1 outside)