Title:
FLATTENING METHOD
Document Type and Number:
Japanese Patent JP2001232555
Kind Code:
A
Abstract:
To provide a method for efficiently flattening a workpiece formed so as to allow a metallic film to be buried in only a groove on a surface of a substrate by a lift-off method and providing a metallic film formed face as a face to be machined.
A surface of a hard material layer accumulated on a soft material layer is used as a lap face, and mechanical lapping polishing a face to be machined of the workpiece is done on the lap face. Furthermore, buff polishing and MCP or CMP are done to flatten the face to be machined of the workpiece.
Inventors:
TAKAHASHI MASAYUKI
TAKAHATA KENICHI
TAKAHATA KENICHI
Application Number:
JP2000045969A
Publication Date:
August 28, 2001
Filing Date:
February 23, 2000
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B24B37/12; B24B37/20; B24B37/22; B24B37/24; H01L21/304; H01L21/306; (IPC1-7): B24B37/00; B24B37/04; H01L21/304; H01L21/306
Attorney, Agent or Firm:
Aoyama Ryo (2 outside people)
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