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Title:
POLISHING PAD AND METHOD FOR MANUFACTURING THEREOF
Document Type and Number:
Japanese Patent JP2001232554
Kind Code:
A
Abstract:

To provide a polishing pad having a layer in direct contact with a machining face of a wafer having many independent cavities and proper hardness, compressibility, and a compression recovery factor, needing no cushion layer on a rear surface, and being free from burr in a groove formed on a polishing face.

This polishing pad is made of a synthetic resin, in particular, a thermoplastic resin. Its Shore D hardness is 50 or more, its compressibility is 1.3 to 5.5%, and its compression recovery rate is 50% or more. It has the groove formed by pressure-contact with a mold member having a protruding streak.


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Inventors:
ONO KOICHI
IMAGAWA HIROSHI
SASAKI YASUSHI
Application Number:
JP2000044696A
Publication Date:
August 28, 2001
Filing Date:
February 22, 2000
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
B24B37/20; B24B37/24; B24B37/26; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
JPS4213560B11967-08-01
JPS58145735A1983-08-30
JPH05226203A1993-09-03
JPS62280236A1987-12-05
JPH08197434A1996-08-06
JPH1177518A1999-03-23
JPH1190809A1999-04-06
JPH1190810A1999-04-06
Foreign References:
WO1998047662A11998-10-29
Attorney, Agent or Firm:
Takao Suzuki (4 others)



 
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