To provide a platen that can carry out polishing without deteriorating shape accuracy and at the same time without using any liberation abrasive polishing liquid such as colloidal silica, and prevents the generation of polishing marks and variation in a machining rate, and to provide a polishing method.
This polishing surface plate 1 of wafers is composed of an organic/inorganic complex being prepared by a method for carrying out the hydrolysis/polycondensation of metal alkoxide or the like under the coexistence of an organic polymer. The organic/inorganic complex is a forming body where a metal oxide of 300 nm or less is uniformly dispersed in the organic polymer within a range of 1 to 60 wt.%. The polished product manufacturing method is used for performing the polishing machining of a wafer by the polishing surface plate 1.
ITO KENJI
HARAGUCHI KAZUTOSHI
OBAYASHI AKIRA
KAWAMURA INST CHEM RES