Title:
FLEXIBLE SUBSTRATE INTEGRATED WAVEGUIDE
Document Type and Number:
Japanese Patent JP2008193663
Kind Code:
A
Abstract:
To provide a manufacturing method which is easier but allows complex structured components.
Planar antennas 4a, 4b, 4c are part of substrate integrated structures, which are connected to electromagnetic waveguides. Furthermore, this invention also allows three-dimensional (3D) structures of the components in a multilayer substrate including a plurality of layers.
Inventors:
KOCH STEFAN
AL-TIKRITI MAYSOUN
AL-TIKRITI MAYSOUN
Application Number:
JP2007330858A
Publication Date:
August 21, 2008
Filing Date:
December 21, 2007
Export Citation:
Assignee:
SONY DEUTSCHLAND GMBH
International Classes:
H01Q1/38; C25D1/02; H01P3/12; H01Q13/08; H01Q21/08
Domestic Patent References:
| JPH11191707A | 1999-07-13 | |||
| JPH11284409A | 1999-10-15 | |||
| JP2004304443A | 2004-10-28 | |||
| JPH11308001A | 1999-11-05 | |||
| JPH10303611A | 1998-11-13 | |||
| JPH11186816A | 1999-07-09 | |||
| JPH10190320A | 1998-07-21 | |||
| JPH02134003A | 1990-05-23 |
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Koji Hagiwara
Tetsuo Kanamoto
Koji Hagiwara
Previous Patent: TRANSCODING NODE AND METHOD FOR MULTIPLE DESCRIPTION TRANCODING
Next Patent: STEGANOGRAPHIC COMMUNICATION METHOD
Next Patent: STEGANOGRAPHIC COMMUNICATION METHOD