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Title:
FLOOR MATERIAL LINKING STRUCTURE
Document Type and Number:
Japanese Patent JP2002303035
Kind Code:
A
Abstract:

To provide a floor material linking structure which is available for linking together floor materials formed of a synthetic resin, wood, etc., where the linking structure is simplified in tying, allows the floor materials to be laid on a place, such as a veranda and a balcony according to the size of the place, prevents detachment or deviation of the floor materials therefrom, and has durability.

According to the floor material linking structure, the floor surface material is mounted on a support frame 4 by means of screws or an adhesive, and a fitting portion 2 formed in an outer peripheral frame 6 of the support frame 4 is connected to the fitting portion of the adjacent floor material, followed by fitting a linking member 3 which is engageable with the fitting portions 2, to thereby sequentially tying the floor materials to each other; and then the outer peripheral frame 6 and a thin section 5 formed on each horizontal member are cut away, whereby the floor materials have a size corresponding to the size of the place.


Inventors:
TOYABE MITSUAKI
Application Number:
JP2001142417A
Publication Date:
October 18, 2002
Filing Date:
April 05, 2001
Export Citation:
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Assignee:
SOOKOO KK
International Classes:
E04F15/02; E04F15/00; (IPC1-7): E04F15/02; E04F15/00