Title:
FLUXLESS SOLDER
Document Type and Number:
Japanese Patent JPH04319091
Kind Code:
A
Abstract:
PURPOSE: To obtain a fluxless solder which is capable of soldering without using flux and without being influenced by contaminating oxides even if any special reactive gas is not applied.
CONSTITUTION: A soldering alloy containing tin, lead and oxides of tin and lead, is still more characterized by including a sufficient amount of a reducing agent which reacts with contaminating metal oxides and oxides of tin and lead adhering to the metal surface when it is provided on a metal surface to be soldered and heated above the m.p. of solder.
Inventors:
UIRUSON EE HORANDO
UIRIAMU II ERIASU
FURANSHISU OO DEYUAN
UIRIAMU II ERIASU
FURANSHISU OO DEYUAN
Application Number:
JP2286592A
Publication Date:
November 10, 1992
Filing Date:
February 07, 1992
Export Citation:
Assignee:
HUGHES AIRCRAFT CO
International Classes:
B23K1/20; B23K35/26; B23K35/40; C22B1/16; C22B5/04; C22C24/00; (IPC1-7): B23K1/20; B23K35/26; B23K35/40; C22B1/16; C22B5/04; C22C24/00
Domestic Patent References:
| JPS5484817A | 1979-07-06 | |||
| JPS5746604A | 1982-03-17 |
Attorney, Agent or Firm:
Takehiko Suzue