FORMATION OF ELECTRIC CONNECTION CONTACT AND MANUFACTURE OF MOUNTED SUBSTRATE

Title:

FORMATION OF ELECTRIC CONNECTION CONTACT AND MANUFACTURE OF MOUNTED SUBSTRATE

Document Type and Number:

Japanese Patent JPH04263433

Kind Code:

A

Abstract:

PURPOSE: To enable the protrusion contacts to be formed easily and collectively on a fine terminal electrode by a method wherein the recessions on the surface of a supporting base material are filled up with the metallic paste mainly comprising a low melting point alloy or a metal and then the metallic paste is melted down to form metallic balls which are transferred to the fine terminal electrode surface.

CONSTITUTION: The recessions provided on the surface of a supporting base material 1 are filled up with metallic paste 2 mainly comprising a low melting point alloy or a metal by sliding a squeegee. Next, the supporting base material 1 is heated at about 230°C using a heating head 4 to form metallic balls 2C by melting down the filled up metallic paste 2b. Finally, when the electrode pads 6 of an IC chip 5 are oppositely pressure-fixed on the metallic balls 2c, the metallic balls 2c can be transferred only to the electrode pads 6 so as to collectively form the title electric connection contacts 7.

Inventors:

WATANABE HIROTOSHI
HATAKEYAMA AKIHITO
HORIO YASUHIKO

Application Number:

JP2442591A

Publication Date:

September 18, 1992

Filing Date:

February 19, 1991

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD

International Classes:

H01L21/60; H05K3/34; (IPC1-7): H01L21/321; H01L21/60

Domestic Patent References:

JPH01308037A	1989-12-12
JPS61117888A	1986-06-05
JPS645039A	1989-01-10
JPH02312240A	1990-12-27

Attorney, Agent or Firm:

Tomoyuki Takimoto

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