PURPOSE: To enable the title electric connection contacts to be formed easily and collectively by a method wherein the recessions provided on the surface of a supporting base material are filled up with the metallic balls mainly comprising a low melting point alloy or a metal and then the fine terminal electrode surface of a board is oppositely pressure-fixed on the metallic balls 2 which are to be transferred to the electrode surface.
CONSTITUTION: The recessions provided on the surface of a supporting base material 1 are filled up with metallic balls 2 mainly comprising a low melting point alloy or a metal. Next, the supporting base material 1 is heated at about 230°C using a heating head 3 to melt down the metallic balls 2. Finally, when the electrode pads 5 of an IC chip 4 are oppositely pressure-fixed on the metallic balls 2, the metallic balls 2 can be transferred only to the electrode pads 5 so as to collectively form the title electric connection contacts 6.
| JP2009506203 | Solder alloy |
| JP7402176 | Manufacturing method of semiconductor device |
| JP2003503852 | [Title of Invention] Structural member and method for manufacturing the same |
HATAKEYAMA AKIHITO
WATANABE HIROTOSHI
| JPH0230140A | 1990-01-31 | |||
| JPS6225435A | 1987-02-03 | |||
| JPS645039A | 1989-01-10 | |||
| JPH02312240A | 1990-12-27 | |||
| JPS59148352A | 1984-08-25 |