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Patent Searching and Data


Title:
FORMATION OF PASSIVATION FILM
Document Type and Number:
Japanese Patent JPS6239018
Kind Code:
A
Abstract:

PURPOSE: To improve the reliability of passivation film while rationalizing the forming process of the same by a method wherein a resist film is postbaked to be used both as a part of passivation film.

CONSTITUTION: A resist film for patterning passivation film is postbaked as necessary to be used both as a part of passivation film. Through these procedures, all the requirements for productivity, reliability upon break on, stain etc. of wafer and chip and prevention of yield deterioration can be met enabling to form remarkably excellent passivation film in terms of the aspect of cost and equipment investment.


Inventors:
YAMAMOTO ISAMU
FUKUSHIMA JIRO
Application Number:
JP17901085A
Publication Date:
February 20, 1987
Filing Date:
August 14, 1985
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/31; H01L21/312; H01L21/56; (IPC1-7): H01L21/312
Domestic Patent References:
JPS59232424A1984-12-27
JPS60154623A1985-08-14
Attorney, Agent or Firm:
Kenichi Hayase