PURPOSE: To eliminate the need for an art work mask, etc., and to improve positioning accuracy by drawing a mask by using an ink injector directly on a transparent mask substrate and by exposing a pattern to resist through the mask.
CONSTITUTION: After solder resist is temporarily dried 4, a transparent mask substrate is mounted 5 on the solder resist. Then, an ink injector ink which functions as a mask is applied 6 on a mask substrate in a region wherein solder resist is removed by using an ink injector. Only a part wherein a solder resist pattern is formed is exposed 7 by irradiating all over a printed wiring board with light. After the transparent mask substrate is peeled off 8, solder resist is developed 9. The solder resist can be set by a dryer 10. A printed wiring board wherein a fixed solder resist pattern is formed can be formed in this way.
Next Patent: FORMATION OF PASTE-LIKE SUBSTANCE LAYER