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Patent Searching and Data


Title:
FORMATION OF RESIST PATTERN, PRINTED WIRING BOARD OBTAINED BY THIS FORMATION AND MANUFACTURE DEVICE THEREOF
Document Type and Number:
Japanese Patent JPH08125312
Kind Code:
A
Abstract:

PURPOSE: To eliminate the need for an art work mask, etc., and to improve positioning accuracy by drawing a mask by using an ink injector directly on a transparent mask substrate and by exposing a pattern to resist through the mask.

CONSTITUTION: After solder resist is temporarily dried 4, a transparent mask substrate is mounted 5 on the solder resist. Then, an ink injector ink which functions as a mask is applied 6 on a mask substrate in a region wherein solder resist is removed by using an ink injector. Only a part wherein a solder resist pattern is formed is exposed 7 by irradiating all over a printed wiring board with light. After the transparent mask substrate is peeled off 8, solder resist is developed 9. The solder resist can be set by a dryer 10. A printed wiring board wherein a fixed solder resist pattern is formed can be formed in this way.


Inventors:
UCHIKAWA KATSUMI
Application Number:
JP26069494A
Publication Date:
May 17, 1996
Filing Date:
October 25, 1994
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
G03F1/54; G03F1/68; H05K3/00; H05K3/28; H05K3/06; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Shintaro Nogawa