Title:
FORMATION OF SOLDER BUMP AND METHOD FOR FORMING THE SOLDER BUMP
Document Type and Number:
Japanese Patent JP3565047
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming solder bumps by which a solder bump that does not cause defective soldered joint can be formed, and to provide a method for forming solder bumps.
SOLUTION: In a method for forming solder bumps, by jointing through welding a solder ball 9 to an electrode on the bottom of a recessed section 3 having an opening smaller than the solder ball 9, metallic paste 5 which contains a metal having a liquidus line temperature higher than that of the solder forming the solder ball 9 is supplied to the recessed section 3, and the solder ball 9 is put on the recessed section 3 and heated to a temperature higher than the liquidus line temperature of the ball 9. Therefore, molten solder can be led to the electrode 2 at the bottom of the recessed section 3 and jointed satisfactorily to the electrode 2 in a heating process, because the metal contained in the paste 5 exists in the recessed section 3 without being melted, when the solder ball 9 is melted.
Inventors:
Ken Maeda
Tadahiko Sakai
Tadahiko Sakai
Application Number:
JP28492298A
Publication Date:
September 15, 2004
Filing Date:
October 07, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L23/12; H01L23/485; H01L23/498; H05K3/34; H05K3/40; (IPC1-7): H01L21/60; H01L23/12
Domestic Patent References:
| JP11126852A | ||||
| JP11145192A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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