Title:
FORMING METHOD OF SOLID CIRCUIT
Document Type and Number:
Japanese Patent JP3417094
Kind Code:
B2
Abstract:
PURPOSE: To uniformly form circuits on the surface of a solid board, by adjusting laser light irradiation in the manner in which the laser light energy absorbed by each surface of a solid of the surface of a solid board becomes almost uniform, and irradiating the surface of the solid board with the laser light.
CONSTITUTION: Energy of leaser light L absorbed by the vertical surface part 4b and the slant surface part 4a of a solid board 1 is made almost uniform. As a means for changing the energy density of the laser light L which which the vertical surface part 4b and the slant surface part 4a are irradiated, a glass mask 10 composed of synthetic quartz wherein the transmittance to the laser light L is changed according to irradiation positions is used. That is, out of the mask 10, a transmission part 15a for transmitting the laser light with which the slant surface part 4a is irradiated is formed so as to transmit 100% of the laser light L. A part 15b for transmitting the laser light with which the vertical surface part 4b is irradiated is formed so as to transmit 50% of the laser light L.
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Inventors:
Go Okamoto
Ryuji Ohtani
Masahide Mutoh
Ryuji Ohtani
Masahide Mutoh
Application Number:
JP28563194A
Publication Date:
June 16, 2003
Filing Date:
November 18, 1994
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B23K26/00; B23K26/06; B23K26/067; B23K26/18; H05K3/00; H05K3/06; H05K3/08; H05K3/18; (IPC1-7): H05K3/00; B23K26/00; B23K26/06; B23K26/18; H05K3/06; H05K3/08; H05K3/18
Domestic Patent References:
| JP677629A | ||||
| JP6177508A | ||||
| JP3255693A | ||||
| JP6297168A |
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)