Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3417095
Kind Code:
B2
Abstract:
PURPOSE: To make it possible to mount a large number of semiconductor devices on a board without need for a larger area, with regard to the semiconductor devices wherein a semiconductor element is resin sealed with a plurality of lead terminals, connected to the electrodes on the semiconductor element, and externally led out.
CONSTITUTION: In a semiconductor device, a semiconductor element 1 is mounted on a stage 3, and a plurality of the electrodes 2 on the semiconductor element 1 are electrically connected with the lead terminals led out of the element in at least two directions. The semiconductor element 1 is sealed with resin 5. Each of the lead terminals 4 externally led out of the resin 5 has an exposed contact face 4a, 4b on the top and bottom.
Inventors:
Nobuo Ohyama
Application Number:
JP28619394A
Publication Date:
June 16, 2003
Filing Date:
November 21, 1994
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/28; H01L23/50; H01L23/52; H01L25/10; H01L25/11; H01L25/18; (IPC1-7): H01L23/50; H01L23/52; H01L25/10; H01L25/11; H01L25/18
Domestic Patent References:
| JP137042A | ||||
| JP2239651A | ||||
| JP645501A | ||||
| JP6243159A |
Attorney, Agent or Firm:
Junichi Yokoyama
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