Title:
FORMULATION CONTAINING SOLID SOLVENT
Document Type and Number:
Japanese Patent JP2022088439
Kind Code:
A
Abstract:
To provide a formulation of an organic semiconductor material that is used to pile by inkjet printing and makes it possible to form an organic semiconductor layer in which a controlled pile has excellent layer characteristics and efficiency performance.SOLUTION: The present invention relates to a formulation comprising at least one organic functional material and at least two different solvents, in which the first organic solvent is liquid at 10°C, the second organic solvent is solid at 10°C, and the solvent mixture contains at least 11 wt.% of the second solvent.SELECTED DRAWING: None
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Inventors:
PHILIP EDWARD MAY
PAWEL MISKIEWICZ
TAN LI WEI
DANIEL WALKER
PAWEL MISKIEWICZ
TAN LI WEI
DANIEL WALKER
Application Number:
JP2022037109A
Publication Date:
June 14, 2022
Filing Date:
March 10, 2022
Export Citation:
Assignee:
MERCK PATENT GMBH
International Classes:
C09K11/06; H01L51/50; H05B33/10
Domestic Patent References:
| JP2014102878A | 2014-06-05 | |||
| JP2009212477A | 2009-09-17 |
Foreign References:
| US20140087507A1 | 2014-03-27 |
Attorney, Agent or Firm:
Masatoshi Kurata
Tadashi Inoue
Shigeru Iino
Naoki Kono
Sanae Kaneko
Tadashi Inoue
Shigeru Iino
Naoki Kono
Sanae Kaneko