To improve chemical convertibility and corrosion resistance by specifying an impurity content in a plating layer.
When an Al-Mg-Si alloy is galvanized, the impurities in the plating layer are controlled as follows. Namely, the content of lead is adjusted to ≤150ppm, that of arsenic to ≤100ppm, that of tin to ≤100ppm, that of cadmium to ≤1000ppm, that of thallium to ≤100ppm and that of copper to ≤500ppm to limit the contents of the impurities in a plating layer. When the impurity content exceeds the upper limit and heavy metals are mixed in the electrically base metal layer, a local cell is formed, the plating layer is dissolved, the corrosion resistance is lowered, and the corrosion resistance of the substrate aluminum alloy sheet is not effectively improved. The plating layer may contain the alloy components such as iron, nickel, chromium, magnesium and silicon as the other components in addition to a pure zinc plating.
NISHIMURA KAZUMI
HONDA KAZUHIKO
KIKUCHI MASAO
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