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Patent Searching and Data


Title:
GRIPPING DEVICE AND GRIPPING METHOD FOR CYLINDRICAL SUBSTRATE
Document Type and Number:
Japanese Patent JP2004255527
Kind Code:
A
Abstract:

To provide a gripping device and a gripping method for a cylindrical substrate capable of gripping an object not only with a fixed diameter but also with a different diameter regardless of the expansion amount of a cylindrical bag, and also to provide a device and a method for gripping having high gripping property and high durability of the bag itself.

In this gripping device where the inside of a bag is put into a vacuumed state to make the outer diameter of the bag small and the bag is inserted into the inner diameter of a cylinder as the gripping object, and then the outer diameter of the bag is made larger by supplying air to the bag inside to come into close contact with the inner diameter of the cylinder, the outline of the bag has a diameter larger than the inner diameter of the cylinder when the bag is not vacuumed or air is not provided thereto.


Inventors:
FURUYA KENJI
TATSUSHIMA TERUJI
Application Number:
JP2003049889A
Publication Date:
September 16, 2004
Filing Date:
February 26, 2003
Export Citation:
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Assignee:
RICOH KK
International Classes:
G03G21/00; B25J15/08; G03G5/05; (IPC1-7): B25J15/08; G03G5/05; G03G21/00
Attorney, Agent or Firm:
Hidehiko Takei